With a clearance of 70mm on the top and 100mm on the bottom, the system easily accommodates the inspection of PCBs with tall components.

The most critical aspect of coating inspection is bubble detection. To ensure precision, we have integrated a 50MP ultra-high-resolution camera with
a 4µm precision lens into the MV-3CC system, enabling effortless detection of bubbles as small as 30µm.
Additionally, the system is equipped with an AI-driven algorithm that continuously improves inspection performance as it learns,
ensuring even greater accuracy over time.

MV-3CC utilizes UV lighting at three angles: low angle, high angle, and coaxial.
Using UV light from a single angle can result in shadows from components or insufficient light intensity, potentially leading to missed defects.
However, MV-3CC provides multi-angle UV illumination, ensuring clear imaging and highly accurate defect detection.

When uncoated areas appear on the side of a chip, leads, or solder, or when coating splatters in unintended areas, or bubbles and cracks form, the 18M high-resolution side camera accurately detects these coating defects

Sensors capable of measuring the thickness of transparent materials, such as coatings and films, can be used to inspect coating thickness on the top surface of components and PCBs